1 Wall St, Unit C103   |   Hudson, NH 03051   |   (603) 718-8445   |   Fax: (603) 718-8934

MANUFACTURING ASSEMBLY

The most important aspects of an RF/Microwave contract manufacturing project is development, validation, and implementation. This guarantees the quality and reliability of your final product. The staff here at Microsembly has many years of experience manufacturing complex microwave circuit assemblies (MCAs) and RF/Microwave modules. We have implemented and perfected our core processes and procedures to ensure the success of your project.
 

CORE PROCESSES

Eutectic Die Attach

Microsembly has extensive experience with the complex process of eutectic die attach eliminating die damage or insufficient adhesion.
 

Epoxy Dispense

Epoxy dispense in an accurate and repetitive fashion is crucial in the manufacturing of complex assemblies. Control of the bond line thickness and the amount of epoxy assures sufficient bond strength and control of the die position and wire bond lengths. This is necessary to maintain performance of microwave frequency modules.
 

Wire Bond

One of the core competencies of Microsembly is ball, web and ribbon bonding. The success of any program relies on having accurate and repeatable control of the bond placement and good height control. A qualification program is developed by Microsembly for each set of wire groups on all programs. In order to assure long term reliability, each type of bonding surface the bonding parameters are tested and optimized. Achieving consistent electrical performance is done by controlling and maintaining loop profiles.
 

Encapsulation

Glob top and dam fill are two of the main types of encapsulation. The protection of devices such as LED's with optically clear encapsulant and silicone's is something that Microsembly has extensive experience with. The design and procurement of frames suitable for containing the encapsulant material is something that Microsembly supports the customer with.
 

ESD Controls

Microsembly ensures that all production areas meet the capability of ANSI/ESD S20.20 and all production areas are fully controlled and monitored for ESD. Full ESD floor grounding/foot straps, consistent monitor wrist straps, ESDM level ionization when required are utilized for each Electrostatic Protected Area ( EPA). The EPA's are also environmentally controlled for humidity levels and temperature.
 

WE ASSEMBLE

  • Attenuators
  • Transistors
  • Diodes
  • GaAs and GaN Devices
  • Mixers
  • Drivers (chip/wire)
  • FETs
  • Filters
  • Multifunction Assemblies (MFAs)
  • Integrated Microwave Assemblies (IMAs)
  • Receivers
  • Sensors
  • Detectors
  • Switches
  • Transmitters
  • Up/down converters
  • Amplifiers

Call us today and learn more about how we can help you.
We are eager to hear from you and answer your questions
(603) 718-8445
1 Wall St Unit C103
Hudson, NH 03051
(603) 718-8445
Fax: (603) 718-8934
 
® Microsembly
All Rights Reserved
 
Designed by The Chalifour Design Group, LLC
1 Wall St, Unit C103   |   Hudson, NH 03051
(603) 718-8445
Fax: (603) 718-8934
 
® Microsembly
All Rights Reserved
Designed by The Chalifour Design Group, LLC