Microsembly has proven time and again, their expertise to support eutectic and epoxy die attach techniques and distinguishing the benefits and differences of both processes.
- Epoxy: The exact control of the epoxy process is required in the manufacture of of numerous microelectronic and optoelectronic devices. Bond lines must be exact in order to maintain good thermal properties. In order to maintain thermal performance and to minimize stresses, full epoxy coverage with no voiding is achieved.
- Eutectic: Eutectic is used whenever thermal or electrical requirements cannot be successful met with the use of epoxy. The eutectic melts and necessitates that the die must be metal backed with gold, silver or a similar allow. The die is bonded to the substrate on a eutectic die attach machine once a preform of the eutectic is placed on the proper pad and the die is bonded. By remelting the eutectic, removing the die and replacing it with a new die and added eutectic material is the process that we use to rework the die attach.