1 Wall St, Unit C103   |   Hudson, NH 03051   |   (603) 718-8445   |   Fax: (603) 718-8934

PRECISION WIRE BONDING HEIGHTS & LOOP

Microsembly brings decades of experience with our team of RF/Microwave engineers, technicians and operators. Wire bonding is also one of the core competencies of Microsembly.
 
Normally, short wire bond lengths are necessary to minimize reflections and double wedge bonding can be used to reduce effective inductance and wire bonding will be optimized to minimize unwanted RF effects. Verifying wire bond reliability by performing pull and shear tests and before and after aging is a standard practice by the experienced team at Microsembly.
 
  • Ball Bonding: Microsembly offers Gold (Au) ball wire bonding. Wire bond diameters from .0007" (17µm) to .002" (50µm) can be handled with a capability for fine pitch wire bonding. Microsembly also utilizes a range of advanced wire bonding techniques including reverse bonding for low loop profiles, die to die bonding and deep access wire bonding in a package to different heights. Microsembly's gold (Au) ball wire bonding services are applied to wide range of package types including ceramic packages, open-cavity plastic packages and PCB's.

  • Wedge Bonding: Aluminum (Al) or Gold (Au) Wedge Bonding .0007" (17µm) to .002" (50µm) diameter wire. Microsembly has vastly experience of wedge bonding when loop height, and spacing are critical to performance.

  • Ribbon Bonding: Gold (Au) from .002" (50µm) to .010" (250µm) width and .00025" (6µm) to .001" (25µm) thickness. The larger surface area of the ribbon makes it an ideal interconnection option for high speed RF applications.

Wire and ribbon bonding on MMICs, ICs, FETs, Diodes, Transistors and other components is something that Microsembly has extensive experience with.
 
We work very closely with our customers at the package design stage to ensure that we apply the design for manufacturing procedure and the wire bond design rules are adhered to. Our experience at Microsembly and capability in wire bonding assists our customers in reducing risk, introducing market penetration for your wire bonding needs and providing a cost effective manufacturing option.
 
Call us today and learn more about how we can help you.
We are eager to hear from you and answer your questions
(603) 718-8445
1 Wall St Unit C103
Hudson, NH 03051
(603) 718-8445
Fax: (603) 718-8934
 
® Microsembly
All Rights Reserved
 
Designed by The Chalifour Design Group, LLC
1 Wall St, Unit C103   |   Hudson, NH 03051
(603) 718-8445
Fax: (603) 718-8934
 
® Microsembly
All Rights Reserved
Designed by The Chalifour Design Group, LLC