1 Wall St, Unit C103   |   Hudson, NH 03051   |   (603) 718-8445   |   Fax: (603) 718-8934

RF/MICROWAVE ASSEMBLIES

Microsembly has the knowledge, expertise and experience in the manufacturing of RF, microwave, and millimeter-wave circuits and assemblies. We are very strong in the areas of mixed RF/digital assembly as well as including micro controllers.
 
Microsembly offers a full range of services for solutions for low to high-volume manufacturers who assemble everything from the straight forward assemblies to the most complex integrated ones.
 
Unique RF and digital manufacturing challenges such as prototype, design test, repair and production are specialties of Microsembly. Eutectic and epoxy die attachment ultrasonic wire or ribbon bonding, advanced thermo compression, manual assembly techniques and ball bonding are all specialties of the dedicated Microsembly team.
 

CAPABILITIES

  • Board Installation (epoxy, solder, screw-down)
  • Feedthru Installation
  • Hand Soldering
  • Surface Mounting
  • Eutectic Die Attach
  • Epoxy Attach
  • Wire Bonding (gold and aluminum)
  • Ribbon Bonding (gold and aluminum)
  • CoilTacking or Winding
  • Beam-lead Diode Attachment
  • Epoxy Encapsulation

Call us today and learn more about how we can help you.
We are eager to hear from you and answer your questions
(603) 718-8445
1 Wall St Unit C103
Hudson, NH 03051
(603) 718-8445
Fax: (603) 718-8934
 
® Microsembly
All Rights Reserved
 
Designed by The Chalifour Design Group, LLC
1 Wall St, Unit C103   |   Hudson, NH 03051
(603) 718-8445
Fax: (603) 718-8934
 
® Microsembly
All Rights Reserved
Designed by The Chalifour Design Group, LLC