Microsembly has the knowledge, expertise and experience in the manufacturing of RF, microwave, and millimeter-wave circuits and assemblies. We are very strong in the areas of mixed RF/digital assembly as well as including micro controllers.
Microsembly offers a full range of services for solutions for low to high-volume manufacturers who assemble everything from the straight forward assemblies to the most complex integrated ones.
Unique RF and digital manufacturing challenges such as prototype, design test, repair and production are specialties of Microsembly. Eutectic and epoxy die attachment ultrasonic wire or ribbon bonding, advanced thermo compression, manual assembly techniques and ball bonding are all specialties of the dedicated Microsembly team.