Precision Eutectic and Epoxy Die Attach
Microsembly demonstrates expertise in both eutectic and epoxy die attach processes, consistently
delivering high-quality results for customers. Our experienced engineering team possesses
in-depth knowledge of the unique advantages and appropriate applications for each die attach
method. We leverage this expertise to provide customers with trusted guidance on selecting the
optimal process for their specific device and performance requirements. Whether eutectic or
epoxy, Microsembly implements robust process controls and rigorous quality assurance, enabling
us to achieve precision, void-free die attach with maximized thermal and electrical conduction.
Our proven capabilities with both techniques, and ability to clearly communicate the trade-offs
between them, positions Microsembly as a dependable partner for supporting a wide range of die
attach needs in electronics manufacturing. With a variety of epoxy types in our inventory,
including renowned brands like Epo-Tek, Namics and Henkel, we cater to a variety of
manufacturing requirements.