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Services

MIXED TECHNOLOGY ASSEMBLY SERVICES

At Microsembly, we prioritize the development, validation, and implementation phases of contract manufacturing to ensure the highest quality and reliability in our customers' final products. Our flexible approach allows you to utilize our services however you need them. You can supply your own materials or provide us with a Bill of Materials (BoM), and we'll handle procuring all the necessary parts. Whether you need a straightforward assembly with just a few components or an intricate build involving complex sub-assembly integration, our expertise can handle it. We have experience with diverse assembly types and are eager to share our knowledge. We support quantities from prototype to full production runs while meeting or beating promised delivery timelines. Our focus is on collaborating with you to bring your product vision to life seamlessly. We've helped customers ranging from small startups to large corporations to optimize and streamline manufacturing processes. Let's discuss your specific project needs. We're confident we can deliver a solution that exceeds your expectations for quality, reliability, and service.

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Assembly Services:

Utilizing our Class 7 and Class 8 Cleanrooms, we proficiently produce a broad spectrum of assemblies, including:

  • Attenuators
  • Transistors
  • Diodes
  • GaAs and GaN Devices
  • Mixers
  • Drivers (chip/wire)
  • FETs
  • Filters
  • Multifunction Assemblies (MFAs)
  • Integrated Microwave Assemblies (IMAs)
  • Receivers
  • Sensors
  • Detectors
  • Switches
  • Transmitters
  • Up/down converters
  • Amplifiers
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Core Capabilities:

  • Board Installation (epoxy, solder, screw-down)
  • RF Microwave Hand Soldering
  • Surface Mount Technology (SMT)
  • Die attach (variety of epoxies, conductive and non-conductive)
  • Beam Lead and Coils Attachment (thermosonics bonding, gap-welding)
  • Eutectic Die Attach (80/20, gold germanium, silicon)
  • Wire and Ribbon Bonding (gold and aluminum)
  • Coil Fabrication (gold and magnet wire)
  • Feed-Thru Installation (Sn, Sn Free, AuSn)
  • Encapsulation (glob top, dam and fill)
  • Bond Pull Testing, Die Shear, Ball Shear
  • Wafer/Die Pick and Packaging
  • Repair of Field Units
  • Troubleshooting
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PCB Assembly:

  • R&D, Prototype to Production with multiple assembly processes and materials.
  • Design and Process Engineering support for PCB Design and Assembly.
  • 01005 components, fine pitch and high count BGAs, Package on Package (POP), Chip on Board (COB), fiber optics, RF microelectronics, press fit connectors.
  • Hybrid processes (tin-lead and lead-free,) pin through hole.
  • RoHS Compliance Certifications
  • Workmanship: IPC-A-610 Class 2 and 3, and J-STD-001.